Senior Photonics Packaging Engineer RF (f/m/d)

Your mission

The future of AI computing is light. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior Photonics Packaging Engineer (f/m/d) , you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.

What makes this role unique:

• High complexity : Developing novel high-density photonic packaging concepts that simultaneously address thermal management, optical alignment, RF signal integrity, and manufacturability – an area with few industry precedents
• Strategic freedom : Broad autonomy to define requirements, select suppliers, and design technical strategies within strategic goals and budgetary limits
• Decision authority : Direct influence on supplier relationships, product architecture decisions, and program economics
• I nnovation mandate: Implementation of at least one new packaging material, process, or architecture annually that becomes differentiating IP for the company
• Real-world impact : Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing Centre

Within your first 18-24 months, you will:

• Achieve leading-edge integration density and performance through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
• Minimize integration risks and rework through rigorous supplier verification and quality assurance
• Contribute to competitive advantage by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market
  
  

Key responsibilities:

• Cross-functional leadership : Coordinate internal R&D, system engineering, manufacturing, and test teams to align packaging solutions with overall product architecture
• Supplier engagement & interface role : Act as the primary point of contact for suppliers, ensuring alignment on technical goals, schedules, and deliverables, including contract management and negotiation
• Project control : Plan and oversee multi-party R&D projects, tracking milestones, budgets, and risks, while ensuring deliverables are verified and integrated into final systems
• Technical specification : Define complete packaging requirements, including optical coupling techniques, thermal management strategies, RF signal integrity, and hermetic sealing methods
• Quality assurance : Ensure supplier quality ratings maintain ≥95% on-time delivery with zero critical defects, and packaging costs remain within ±5% of budgeted targets

Your profile

Education & Experience:

• More than 5 years of experience in hybrid packaging, photonics assembly, optoelectronic integration, or related high-density interconnect technologies
• Proven track record in managing supplier-led R&D and packaging projects, from requirements definition through to integration and validation
• Hands-on experience with PICs, laser sources, photodetectors, analog electronics, and mixed-signal integration
• Master's or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field

Deep Technical Expertise in:

• Optical coupling techniques (butt-coupling, lens coupling, fiber array integration)
• Thermal management strategies for high-power photonic devices
• Understanding and enhancement of RF signal integrity for highest performance in different high density interconnects
• Packaging material science (polymers, ceramics, metals) and hermetic sealing methods
• Relevant standards for reliability and environmental testing (e.g., Telcordia, JEDEC)

Tools & Processes:

• Familiarity with CAD tools for photonics/electronics packaging, optical simulation software, and statistical process control
  

Leadership & Coordination Skills:

• Exceptional ability to lead cross-functional teams across R&D, system engineering, manufacturing, and test domains
• Skilled in negotiation and contract management with external suppliers and R&D partners
• Strong systems thinking to balance optical, electrical, thermal, and mechanical requirements simultaneously
• Excellent communication skills with the ability to translate complex technical trade-offs to management and stakeholders

Languages:

• Fluent in English ; German or other European language beneficial

Preferred Qualifications:

• Experience with photonic integrated circuit (PIC) packaging for AI or HPC applications
• Knowledge of high-speed digital interfaces and their integration with photonic systems
• Familiarity with scaling systems from prototype to volume production
• Understanding of supply chain management and material supplier ecosystems in photonics

Why us?

• Make impact at scale: Help solve one of computing's biggest challenges—making growing demand in compute and sustainability go hand in hand
• Work on the leading edge: Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
• Own your work from day one: Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
• Fast-track your growth: Work on challenges with few industry precedents—every problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systems
• Direct access to leadership: Work closely with the company's founders, including CEO Dr. Michael Förtsch, and advisory board members who shaped the semiconductor industry (ARM, Intel, Infineon)
• Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
• Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformation

We're looking for a technical leader who gets energized by developing novel photonic packaging solutions, managing supplier partnerships, and driving innovations that enable production systems to transform AI computing already today.

Ready to shape the future of photonic integration?

We are looking forward to receiving your application!

Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

About us

Who we are and what we do

Q.ANT is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC applications. In collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS, Q.ANT operates its own pilot line for photonic chips, based on the material system Thin-Film Lithium Niobate TFLN. Q.ANT was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart, Germany.